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TEKMAT™ SiO2

Spherical and Densified Silica Powder

Physical Propeties
Chemical Formula:
Molecular Weight:
Melting point:
Boiling point:
Density:
Heat Capacity:
Thermal conduct.:		 SiO2
60.1 g/mol
1750°C
2355°C
2.65 g/cm3
937 J/g-°C
1.3W/m-K

 Silica is widely used in the electronic industry in circuit boards and semiconductor devices due to its properties of good abrasion resistance, electrical insulation and high thermal stability.

Tekna’ spherical and densified TEKMAT™ Silica Powder offers better flow-ability than standard silica powder, making it an excellent precursor for applications requiring high quality silica powder.

This product is not kept in stock and is available on a custom basis only. Batches are produced based on customer needs. Typical size fractions are the following:

  • -60+140 mesh (-250+105 µm),
  • -80+170 mesh (-180+90 µm),
  • -100+325 mesh (-150+45 µm);
  • -325 mesh (-45 µm).

Size fractions may also be customized to meet customer’s technical criteria for a specific application.


Please contact us for more information.