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Spherical and Densified Silica Powder

Physical Propeties
Chemical Formula:
Molecular Weight:
Melting point:
Boiling point:
Density:
Heat Capacity:
Thermal conduct.:		 SiO2
60.1 g/mol
1750ºC
2355ºC
2.65 g/cm3
937 J/g-°C
1.3W/m-K
 

 Silica is widely used in the electronic industry in circuit boards and semiconductor devices due to its properties of good abrasion resistance, electrical insulation and high thermal stability.

Tekna’ spherical and densified Silica Powder offers higher density, higher purity and better flow-ability than standard silica powder making it an excellent precursor for applications requiring high quality silica powder.

Various size fractions are available from a few microns to several hundreds microns.
Most typical size fractions are the following:

  • -40+60 mesh (-420+250 um),
  • -60+80 mesh (-250+180 um),
  • -80+120 mesh (-180+125 um),
  • -100+325 mesh (-150+44 um);
  • -325 mesh (-44 um).

Size fraction can also be customized to meet customer’s technical criteria for specific application.


Please contact us for more information.